dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7
authorKrzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Fri, 13 Jan 2023 09:01:07 +0000 (10:01 +0100)
committerDaniel Lezcano <daniel.lezcano@linaro.org>
Mon, 16 Jan 2023 10:22:30 +0000 (11:22 +0100)
commit4b39ffa625d202c71d8ac25c763ef3831abc59e4
tree7d12043f46de99fd0d0ec967a7e037660b57f844
parent5bc494a8ce397efba41277463cd38d3866a78090
dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7

The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC.  Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device.  This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml