dt-bindings: soc: socionext: Add UniPhier DWC3 USB glue layer
authorKunihiko Hayashi <hayashi.kunihiko@socionext.com>
Tue, 13 Dec 2022 08:24:48 +0000 (17:24 +0900)
committerRob Herring <robh@kernel.org>
Mon, 26 Dec 2022 22:09:29 +0000 (16:09 -0600)
commit5993f6bd555e2696bb4d79cf54b976cb58793534
treedbdc529af32fc7f985bc3e9b28eb082432ffa71d
parent0c00d8d315f09ef8639369a7f12e270b7a86bf79
dt-bindings: soc: socionext: Add UniPhier DWC3 USB glue layer

Add DT binding schema for components belonging to the platform-specific
DWC3 USB glue layer implemented in UniPhier SoCs.

This USB glue layer works as a sideband logic for the host controller,
including core reset, vbus control, PHYs, and some signals to the
controller.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221213082449.2721-17-hayashi.kunihiko@socionext.com
Signed-off-by: Rob Herring <robh@kernel.org>
Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml [new file with mode: 0644]