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arm64: dts: renesas: r8a779f0: Add thermal support
authorLinh Phung <linh.phung.jy@renesas.com>
Wed, 25 May 2022 15:13:55 +0000 (17:13 +0200)
committerGeert Uytterhoeven <geert+renesas@glider.be>
Fri, 17 Jun 2022 07:35:25 +0000 (09:35 +0200)
commit5a3ad6f466fe7a187cbf4889d80a48606181c367
tree34bde726b312cb11aa79371b18ba1845786ad516tree | snapshot
parentdc24257124dba514164bd708dc1f4ca07538da00commit | diff
arm64: dts: renesas: r8a779f0: Add thermal support

Add support for 3 TSC nodes of thermal. The 4th node is for the control
domain and not for Linux.

Signed-off-by: Linh Phung <linh.phung.jy@renesas.com>
[wsa: rebased, fixed resource size, removed unused 4th node breaking probe]
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20220525151355.24175-1-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
arch/arm64/boot/dts/renesas/r8a779f0.dtsi diff | blob | history
ep93xx device tree rework repo: git://git.maquefel.me/linux.git