dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
authorAmit Kucheria <amit.kucheria@linaro.org>
Fri, 3 Apr 2020 07:01:47 +0000 (12:31 +0530)
committerDaniel Lezcano <daniel.lezcano@linaro.org>
Fri, 22 May 2020 15:57:44 +0000 (17:57 +0200)
commit73c46acf915385e27f3312e77717d27eff74c08a
tree632a633de4f165f4fe069bd886d418227935176d
parentc1bba2c94decdec382c6a07d9ba722cefd617575
dt-bindings: thermal: Add yaml bindings for thermal cooling-devices

As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.

The property #cooling-cells is required in each device that acts as a
cooling device - whether active or passive. So any device that can
throttle its performance to passively reduce heat dissipation (e.g.
CPUs, GPUs) and any device that can actively dissipate heat at different
levels (e.g. fans) will contain this property.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml [new file with mode: 0644]