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arm64: dts: hi3660: Add thermal cooling management
authorTao Wang <jean.wangtao@linaro.org>
Tue, 15 May 2018 02:53:14 +0000 (10:53 +0800)
committerWei Xu <xuwei5@hisilicon.com>
Tue, 15 May 2018 13:52:12 +0000 (14:52 +0100)
commit8d93e94beee7a2bd74144f9d2c8e097d2bda5642
treec56d0efd34e507206b418c588ab2d43cfed55633tree | snapshot
parentdfeae9e5e54a88ad1bf3a1e30faf2640688886adcommit | diff
arm64: dts: hi3660: Add thermal cooling management

Add nodes and properties for thermal cooling management support.

Signed-off-by: Tao Wang <jean.wangtao@linaro.org>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
arch/arm64/boot/dts/hisilicon/hi3660.dtsi diff | blob | history
ep93xx device tree rework repo: git://git.maquefel.me/linux.git