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(parent: faa4b9d) | patch
staging: ti-soc-thermal: remove external heat while extrapolating hotspot
authorEduardo Valentin <eduardo.valentin@ti.com>
Wed, 24 Apr 2013 18:16:08 +0000 (14:16 -0400)
committerGreg Kroah-Hartman <gregkh@linuxfoundation.org>
Mon, 13 May 2013 22:02:30 +0000 (18:02 -0400)
commita85fd2c8fdefa0d504882f0e110d68e564903fcb
tree890827b3722a79c9cf519af93b290944e3d5edc5tree | snapshot
parentfaa4b9de12fa433f06be917feb3f13792b12fefacommit | diff
staging: ti-soc-thermal: remove external heat while extrapolating hotspot

For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
drivers/staging/ti-soc-thermal/ti-thermal-common.c diff | blob | history
ep93xx device tree rework repo: git://git.maquefel.me/linux.git