Merge tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/therma...

Pull thermal control material for 5.19-rc1 from Daniel Lezcano:

 - Add the new k3 j72xx bangdap driver and the corresponding bindings (Keerthy)

 - Fix the missing of_node_put() in the SC iMX driver at probe timer (Miaoqian Lin)

 - Fix memory leak in __thermal_cooling_device_register() when device_register()
   fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang)

 - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support
   for QCom tsens driver (Bjorn Andersson)

 - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L
   and bindings documentation for RZ/G2UL (Biju Das)

 - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe)

 - Remove unneeded semi colon in libthermal and tools thermal as reported by
   cocci (Jiapeng Chong)

 - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform
   (Zheng Yongjun)

 - Add thermal library and thermal tools to encapsulate the netlink into event
   based callbacks (Daniel Lezcano)

 - Add change mode ops for the thermal-of sensor (Manaf Meethalavalappu
   Pallikunhi)

 - Fix non negative value support by preventing the value to be clamp to zero
   (Stefan Wahren)

 - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry
   Baryshkov)

 - Add hwmon support for K3 driver (Massimiliano Minella)

 - Refactor and add multiple generations support for QCom ADC driver (Jishnu
   Prakash)

 - Use platform_get_irq_optional() to get the interrupt on RCar driver and
   document Document RZ/V2L bindings (Lad Prabhakar)

* tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (28 commits)
  thermal: k3_j72xx_bandgap: Add the bandgap driver support
  dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
  thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
  thermal/core: Fix memory leak in __thermal_cooling_device_register()
  dt-bindings: thermal: tsens: Add sc8280xp compatible
  dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
  thermal/drivers/qcom/lmh: Add sc8180x compatible
  thermal/drivers/rz2gl: Fix OTP Calibration Register values
  dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
  thermal: thermal_of: fix typo on __thermal_bind_params
  tools/thermal: remove unneeded semicolon
  tools/lib/thermal: remove unneeded semicolon
  thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
  tools/thermal: Add thermal daemon skeleton
  tools/thermal: Add a temperature capture tool
  tools/thermal: Add util library
  tools/lib/thermal: Add a thermal library
  thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensor
  thermal/drivers/bcm2711: Don't clamp temperature at zero
  thermal/drivers/tsens: Add compat string for the qcom,msm8960
  ...