From: Neil Armstrong <neil.armstrong@linaro.org>
Date: Wed, 16 Nov 2022 10:09:50 +0000 (+0100)
Subject: dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
X-Git-Url: http://git.maquefel.me/?a=commitdiff_plain;h=4a9f20112c22cdcd6b81fafb18534a2a5a629a14;p=linux.git

dt-bindings: thermal: qcom-tsens: Add compatible for sm8550

The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
---

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 5bcfddc877d36..7e04804b6e80b 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -58,6 +58,7 @@ properties:
               - qcom,sm8250-tsens
               - qcom,sm8350-tsens
               - qcom,sm8450-tsens
+              - qcom,sm8550-tsens
           - const: qcom,tsens-v2
 
       - description: v2 of TSENS with combined interrupt