From: Greg Kroah-Hartman Date: Fri, 20 Mar 2020 12:45:25 +0000 (+0100) Subject: Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into... X-Git-Url: http://git.maquefel.me/?a=commitdiff_plain;h=c23ff2aa3e783c7a2fffd2dd40cd686b8f597da8;p=linux.git Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into char-misc-next Georgi writes: interconnect changes for 5.7 Here is a pull request with interconnect changes for the 5.7-rc1 merge window. It contains just driver updates, and these are: - Refactoring of the SDM845 driver, which is now improved to better represent the hardware. - New driver for SC7180 platforms. - New driver for OSM L3 interconnect hardware found on SDM845/SC7180 platforms. Signed-off-by: Georgi Djakov * tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux: interconnect: qcom: Add OSM L3 support on SC7180 dt-bindings: interconnect: Add OSM L3 DT binding on SC7180 interconnect: qcom: Add OSM L3 interconnect provider support dt-bindings: interconnect: Add OSM L3 DT bindings interconnect: qcom: Allow icc node to be used across icc providers interconnect: qcom: Add SC7180 interconnect provider driver dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings interconnect: qcom: sdm845: Split qnodes into their respective NoCs interconnect: qcom: Consolidate interconnect RPMh support dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings dt-bindings: interconnect: Add YAML schemas for QCOM bcm-voter dt-bindings: interconnect: Convert qcom,sdm845 to DT schema --- c23ff2aa3e783c7a2fffd2dd40cd686b8f597da8